High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram

PRODUCT PARAMETERS

Description
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Description

Overview of Heatlinks

Heatlinks function by providing a path of low thermal resistance between a heat source (such as an electronic component) and a heat sink or cooling system. They can be particularly useful in environments where space constraints limit the use of traditional cooling methods, or when a passive thermal management solution is preferred.

Heatlinks can operate based on different principles, including phase change materials, solid-state conduction, or even fluid-based systems. The choice of technology depends on the application’s specific requirements, such as operating temperature range, power dissipation levels, and spatial limitations.

Features of Heatlinks

High Thermal Conductivity: Designed to offer high thermal conductivity, ensuring efficient heat transfer from the source to the sink.

Compact Design: Often compact, allowing them to fit into tight spaces within electronic assemblies or other equipment.

Passive Operation: Typically do not require external power to function, relying instead on the natural flow of heat from hot to cold areas.

Durability and Reliability: Manufactured to withstand repeated thermal cycles and harsh environmental conditions without degradation of performance.

Low Profile: Thin profiles help minimize the impact on the overall design of products.

Versatility: Can be tailored to fit various applications, from consumer electronics to industrial machinery and aerospace components.

Customizable: Available in different shapes, sizes, and configurations to meet specific design needs.

Cost-Effective: Provide an economical solution for thermal management compared to more complex cooling systems.

Minimal Maintenance: Generally require little to no maintenance once installed.

Environmental Compatibility: Designed to be compatible with a wide range of environments, including those that may contain corrosive elements or experience significant temperature fluctuations.

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram

(High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram)

Specifications of High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram

Heat Resistant Heatsink Air Conditioning Space Filler Pad Thermal Conductive Silicone Pad is made to take care of heat in electronic devices. It benefits CPUs, GPUs, RAM components, and various other elements requiring thermal control. The pad fills up gaps between heat-generating components and heatsinks. This boosts heat transfer and avoids getting too hot.

The silicone product supplies high thermal conductivity. It relocates warm away from sensitive areas efficiently. The pad stands up to severe temperature levels. It runs dependably between -50 ° C and 250 ° C. This makes it ideal for demanding settings.

Trick attributes consist of soft qualities and versatility. The pad adapts to unequal surfaces conveniently. It eliminates air pockets that lower cooling performance. No fluid or paste is called for. This prevents mess and simplifies installation. The product stays steady under long-lasting warm exposure. It stands up to aging, tearing, and chemical rust.

Multiple density options are available. Usual sizes consist of 1mm, 1.5 mm, 2mm, and customized orders. Users cut the pad to fit specific components. Pressure-sensitive adhesive on both sides makes sure safe placement. No curing time is needed.

The pad replaces conventional thermal paste or grease. It provides constant performance without drying. Reusability is an advantage. The pad can be repositioned during upkeep. It keeps efficiency after reapplication.

Applications cover computer systems, servers, LED lights, power materials, and industrial tools. Automotive electronic devices take advantage of its high-temperature resistance. The pad minimizes thermal strangling in CPUs and GPUs. This enhances device performance and life expectancy.

Electrical insulation is another advantage. The silicone material avoids brief circuits. It is risk-free for direct call with digital components.

Requirements include thermal conductivity of 6.0 W/mK. The operating temperature level array is -50 ° C to 250 ° C. Available thicknesses range from 0.5 mm to 5mm. Common sheet sizes are 100mm x 100mm or 200mm x 200mm. Custom-made dimensions are supported. The product passes UL 94 V-0 flammability testing.

Setup actions are simple. Clean the surfaces initially. Get rid of safety film from the pad. Press it strongly onto the part. Affix the heatsink. Apply even pressure for complete attachment.

The pad fits high-performance computing, gaming systems, and information facilities. It makes certain secure thermal administration under hefty workloads. Industrial machinery and automobile systems use it for reliable heat dissipation.

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram

(High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram)

Applications of High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram

The high temperature immune heatsink cooling gap filler pad is a thermal conductive silicone pad utilized to take care of heat in electronic tools. It moves heat away from components like CPUs, GPUs, and RAM. This avoids overheating and enhances efficiency. The pad fills up voids in between heat-generating parts and heatsinks. This makes certain optimum get in touch with for reliable warm dissipation.

This item is produced high-temperature settings. It remains steady under extreme warmth. It works in temperatures as much as 200 ° C or higher. This makes it ideal for requiring applications like gaming PCs, servers, and commercial machinery. The material is silicone-based. Silicone is flexible and sturdy. It adapts to uneven surfaces between elements and heatsinks. This removes air pockets that decrease cooling performance.

The pad is simple to set up. It needs no adhesives or devices. Individuals sufficed to size and place it between the element and heatsink. Stress from mounting hardware makes certain proper get in touch with. Upkeep is very little. The pad does moist out or crack in time. It lasts longer than typical thermal pastes or tapes.

Compatibility is broad. It deals with a lot of CPU and GPU versions. It fits RAM components and other chips. The pad is offered in several densities and sizes. Users select the very best choice for their setup. Electric insulation is an additional benefit. The silicone product protects against short circuits. It shields delicate electronics while handling warm.

Applications consist of gaming gears, information centers, electrical cars, and telecom equipment. High-performance computer requires reputable air conditioning. Overheating reasons lag, crashes, or equipment damage. This pad lowers such threats. Industrial equipments create constant warm. The pad makes sure steady procedure in factories or nuclear power plant.

The thermal conductive silicone pad is an economical option. It improves gadget life expectancy and efficiency. Individuals conserve cash on repair services or substitutes. Customized dimensions are readily available for customized jobs. Mass orders fit massive production demands.

This item meets safety and high quality criteria. It is evaluated for thermal conductivity and sturdiness. Makers trust it for vital systems. The pad is commonly made use of in electronics and heavy markets.

Company Profile

PDDN Photoelectron Technology Co., Ltd.(sales@pddn.com) is one of the leading enterprises in power electronics technology and power products, which is fully involved in developing solar inverters, transformers, voltage regulators, distribution cabinets, thyristors, modules, diodes, heaters, and other electronic devices or semiconductors. We will be committed to providing users with high-quality, efficient products and considerate service.

It accepts payment via Credit Card, T/T, West Union, and Paypal. PDDN will ship the goods to customers overseas through FedEx, DHL, by sea, or by air. If you want high-quality High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram, please send us inquiries; we will be here to help you.


Payment Methods

L/C, T/T, Western Union, Paypal, Credit Card etc.


Shipment

By sea, by air, by express, as customers request.


Storage Conditions

1) Store in a dry environment at room temperature.

2) Avoid damp and high temperature.

3) Use immediately after opening the inner packing bag.

5 FAQs of High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram

What is a high-temperature resistant heatsink cooling gap filler pad? This pad is a soft silicone material used to transfer heat from electronic parts like CPUs, GPUs, or RAM to heatsinks. It fills empty spaces between components and cooling systems. This improves heat dissipation and prevents overheating. The pad is flexible, making it easy to fit uneven surfaces. It replaces messy thermal pastes or tapes.

How does the thermal conductive silicone pad work? The pad fills gaps between the heat source and the heatsink. Air pockets trap heat and reduce cooling efficiency. The silicone material pushes out air and creates direct contact. Heat moves from the component to the heatsink faster. This keeps temperatures stable during heavy use. It works for long periods without breaking down.

What temperatures can this pad handle? The pad resists temperatures up to 200°C (392°F). It stays stable in extreme heat from gaming, overclocking, or industrial machines. The material doesn’t melt or crack under high thermal stress. It performs better than standard thermal pads in hot environments. This makes it ideal for devices running at maximum load.

How do I install the silicone pad correctly? Clean the component and heatsink surfaces first. Cut the pad to match the size of the hardware. Remove the protective film from both sides. Press the pad firmly onto the component. Reattach the heatsink and secure it evenly. Check for full contact between surfaces. Replace the pad if it hardens or wears out over time.

Is the pad safe for electronics? The silicone material is non-conductive. It doesn’t cause short circuits or interfere with electrical signals. It resists moisture, dust, and chemicals. No harmful reactions occur with metal or plastic parts. The pad reduces vibration damage by cushioning components. It protects hardware while improving cooling performance.

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram

(High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad for Cpu Gpu Ram)

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