Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB

Overview of Heatlinks

Heatlinks function by providing a path of low thermal resistance between a heat source (such as an electronic component) and a heat sink or cooling system. They can be particularly useful in environments where space constraints limit the use of traditional cooling methods, or when a passive thermal management solution is preferred.

Heatlinks can operate based on different principles, including phase change materials, solid-state conduction, or even fluid-based systems. The choice of technology depends on the application’s specific requirements, such as operating temperature range, power dissipation levels, and spatial limitations.

Features of Heatlinks

High Thermal Conductivity: Designed to offer high thermal conductivity, ensuring efficient heat transfer from the source to the sink.

Compact Design: Often compact, allowing them to fit into tight spaces within electronic assemblies or other equipment.

Passive Operation: Typically do not require external power to function, relying instead on the natural flow of heat from hot to cold areas.

Durability and Reliability: Manufactured to withstand repeated thermal cycles and harsh environmental conditions without degradation of performance.

Low Profile: Thin profiles help minimize the impact on the overall design of products.

Versatility: Can be tailored to fit various applications, from consumer electronics to industrial machinery and aerospace components.

Customizable: Available in different shapes, sizes, and configurations to meet specific design needs.

Cost-Effective: Provide an economical solution for thermal management compared to more complex cooling systems.

Minimal Maintenance: Generally require little to no maintenance once installed.

Environmental Compatibility: Designed to be compatible with a wide range of environments, including those that may contain corrosive elements or experience significant temperature fluctuations.

(Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB)

Specifications of Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB

The Fin Aluminum Heatsink with Silver Oxide Surface 6000 Collection Quality provides trusted thermal administration for IC components, computer systems, LED PCBs, and comparable electronic devices. The heatsink makes use of 6000 collection light weight aluminum alloy, known for high stamina and outstanding warm dissipation. The silver oxide surface area treatment boosts rust resistance and boosts thermal conductivity. This combination makes sure secure performance in high-temperature atmospheres.

The item supports custom boxing services to satisfy particular layout requirements. The boxing procedure preserves architectural integrity while developing specific holes or forms for placing parts. Resistances are managed within ± 0.1 mm to guarantee compatibility with IC components, connectors, and PCB formats. The heatsink’s fin design raises surface area, advertising faster heat transfer far from delicate components.

Requirement density ranges from 1.0 mm to 8.0 mm, with sizes as much as 500mm. Thermal conductivity gets to 200 W/m · K, appropriate for high-power applications. The silver oxide layer includes very little weight, maintaining the heatsink lightweight for small devices. Surface area roughness is maintained below Ra 1.6 μm to stay clear of damages to linked components.

Applications include LED illumination systems, computer motherboards, power converters, and industrial control modules. The heatsink deals with passive or forced-air cooling configurations. Modification options cover opening patterns, fin density, and baseplate measurements. Examples are offered for testing before automation.

The 6000 series aluminum stands up to flexing or contorting under thermal anxiety. The silver oxide finish avoids oxidation, expanding service life. Production makes use of CNC punching devices for consistency. Each batch undertakes thermal cycling tests and surface quality checks. Preparation is 7-10 days for basic orders, with rush solutions upon request.

Product packaging consists of anti-static foam and moisture-proof bags to secure surface areas throughout delivery. Technical support aids with thermal simulations or design adjustments. Bulk orders receive reduced pricing. Substitute components match original specifications to keep system compatibility.

(Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB)

Applications of Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB

The Fin Light Weight Aluminum Heatsink with Silver Oxide Surface 6000 Series Quality Punching Service is created for high-performance thermal administration in electronic devices. This product makes use of 6000 series aluminum alloy known for strength and heat resistance. The silver oxide surface area enhances rust resistance and boosts warm dissipation. The punching service enables precise personalization for different part formats.

This heatsink works well in IC modules. Integrated circuits create warm throughout procedure. Efficient air conditioning avoids overheating and expands tool life. The silver oxide layer ensures stable efficiency in damp or high-temperature atmospheres. Custom punching fits specific component designs without added machining.

PC and computer system systems benefit from this service. Cpus and graphics cards require dependable cooling under heavy workloads. The aluminum base soaks up warmth rapidly. The fin style boosts surface area for faster air movement cooling. Custom forms suit motherboard layouts for compact builds.

LED PCB applications require reliable warmth control. High-power LEDs produce significant thermal power. Poor dissipation brings about light degeneration or failing. The heatsink’s silver oxide surface area withstands oxidation from long term direct exposure. Punching solution adapts to various PCB sizes and LED arrangements.

Industrial electronics use this heatsink for toughness. Rough problems require materials that endure vibration and temperature level shifts. The 6000 collection aluminum preserves architectural integrity under tension. Silver oxide prevents surface area destruction over time. Custom-made holes or intermediaries incorporate with existing equipment arrangements.

The punching service sustains rapid prototyping and automation. Makers adjust opening patterns or fin thickness based upon screening results. This adaptability decreases lead times and expenses. Exact tolerances make sure compatibility with ICs, CPUs, or LED varieties.

This product combines product advantages with customized manufacturing. The light weight aluminum alloy offers a balance of agility and thermal conductivity. Silver oxide adds security without minimizing warmth transfer effectiveness. Custom-made punching adapts the heatsink to varied electronic arrangements.

Company Profile

PDDN Photoelectron Technology Co., Ltd.(sales@pddn.com) is one of the leading enterprises in power electronics technology and power products, which is fully involved in developing solar inverters， transformers, voltage regulators, distribution cabinets, thyristors， modules， diodes， heaters, and other electronic devices or semiconductors. We will be committed to providing users with high-quality, efficient products and considerate service.

It accepts payment via Credit Card, T/T, West Union, and Paypal. PDDN will ship the goods to customers overseas through FedEx, DHL, by sea, or by air. If you want high-quality Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB, please send us inquiries; we will be here to help you.

Payment Methods

L/C, T/T, Western Union, Paypal, Credit Card etc.

Shipment

By sea, by air, by express, as customers request.

Storage Conditions

1) Store in a dry environment at room temperature.

2) Avoid damp and high temperature.

3) Use immediately after opening the inner packing bag.

5 FAQs of Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB

What makes the 6000 series aluminum heatsink a good choice? The 6000 series aluminum offers high thermal conductivity. This helps move heat away from sensitive parts fast. The material is strong yet lightweight. This makes it suitable for electronics needing efficient cooling without extra bulk.

Why use a silver oxide surface on the heatsink? Silver oxide improves corrosion resistance. This extends the heatsink’s lifespan in humid or high-temperature environments. The surface also enhances heat dissipation. It ensures stable performance for IC modules, LED PCBs, and computer components.

Can this heatsink fit different IC modules or LED PCBs? Yes. The punching service allows custom sizing and hole patterns. Precise measurements ensure compatibility with various designs. Specify your requirements for thickness, fin density, or mounting holes. Adjustments are made to match your exact needs.

How durable is the silver oxide-coated aluminum heatsink? The 6000 series aluminum base resists physical wear. The silver oxide layer prevents chemical degradation. Together, they handle heavy loads and long operating hours. This combo works well in industrial equipment or high-power LED systems.

What customization options come with the punching service? The service supports creating unique shapes, cutouts, or grooves. Complex designs for computer or PCB applications are achievable. Custom fins improve airflow for better cooling. Share your project details. The team will adjust production to meet thermal or mechanical specs.

(Fin Aluminum Heatsink with Silver Oxide Surface 6000 Series Grade Punching Service for IC Module PC Computer LED PCB)